SPA – R Selective Solder Rework System
With unique „Fast Remove“ Pumpsystem
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Display easy to operate
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Timer-Function
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Pump and Solder bath made of full Titanium best for lead free alloys
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On the fly – Wave hight regulation
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Standby-Function to reduce process time
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Wide range of standard solder nozzles and customized nozzles
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Huge top space for very large boards
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Optional Laserpointer und XY – Table
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Optional Nitrogen Inert to reduce dross
- Magnetic PCB-fixtures in different sizes,
for free positioning
- Wide range of standard solder nozzles and customized nozzles
The solder pump system
The unique flat pump design with a superb „ Fast Remove” system allows maintenance within minutes. Just an easy turn with the supplied tooling gives instant access to the pump and solder bath.
Technical Data
Power: 220 V (50/60 Hz) / 2 KW
Temperature: 0 – 400 °C
Solder Capacity: ca. 20 kg
PCB size: no Limits
Measurements: 400 (B) x 700 (L) x 250 (H) mm
Weight: ca. 35 kg with empty solder pot