EBSO

SPA – R Selective Solder Rework System

With unique „Fast Remove“ Pumpsystem

  • Display easy to operate

  • Timer-Function

  • Pump and Solder bath made of full Titanium best for lead free alloys

  • On the fly – Wave hight regulation

  • Standby-Function to reduce process time

  • Wide range of standard solder nozzles and customized nozzles

  • Huge top space for very large boards

  • Optional Laserpointer und XY – Table

  • Optional Nitrogen Inert to reduce dross

  • Magnetic PCB-fixtures in different sizes,

    for free positioning

  • Wide range of standard solder nozzles and customized nozzles

The solder pump system

The unique flat pump design with a superb „ Fast Remove” system allows maintenance within minutes. Just an easy turn with the supplied tooling gives instant access to the pump and solder bath.

spa-r_6


Technical Data

Power: 220 V (50/60 Hz) / 2 KW
Temperature: 0 – 400 °C
Solder Capacity: ca. 20 kg
PCB size: no Limits
Measurements: 400 (B) x 700 (L) x 250 (H) mm
Weight: ca. 35 kg with empty solder pot


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