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The Ebso SPA200- is a high flexible Miniwave soldering system at a power rate of 3,5 KW only at 220 V
A XYZ axis carrier system moves the PCB over the fluxer, preheater and solder module. To reduce oxide in the solder bath and especially for high quality solder results nitrogen is provided to the solder bath and solder pump unit.
Bath and Pump is made of Titanium ready for lead free solder alloy.
The SPA200. Is designed for selective soldering through hole components like Connectors, transformers, relays, coils etc. |
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A large selection of nozzles for all component shapes and sizes assures best results for different applications.
The Ebso Offline Editor is a Windows based programming software.
The easy „point&click“ procedure makes it possible to produce a soldering program within a few minutes. |
| Titanium Solder bath |
Standard |
| Flux module with precise Microdrop Fluxer |
Standard |
| 2 Liter stainless steel Flux Pot incl. flux level monitoring |
Standard |
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Siemens Panel with S7 PLC incl.
N2 monitoring, Exhaust monitoring |
Standard |
| 1 Standard Universal-Lötrahmen |
Standard |
| Universal-Solder-Frame one standard Nozzle |
Optional |
The Ebso SPA200 is an automatic selective soldering system. Solder bath and solder pump is covered with nitrogen. Designed for automatic soldering of connectors, transformers, coils and other conventional components. Especially for applications which are not suitable for a wave soldering process or to automize hand soldering.
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XYZ – axis carrier system +-0,1 mm |
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Transportangle 7° (Optional 0°) |
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Max. pcb size 200 x 200 mm |
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Max. frame/fixture size 240 x 240 mm |
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Microdrop Fluxer for single point and line fluxing with 2 L flux pot and flux level control |
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20 kg Titanium pot and pump unit suitable for lead free solder alloys |
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Universal Solder Frame and one Standard Solder Nozzle |
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Siemens Panel |
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Exhaust control sensor |
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N2 control, Solder Level control, Flux Level Control |
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Light-Tower |
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Nozzle Changeover tooling, Safety Cloves, Solder tool |
